1 / 4 www.asb.co.kr january 2011 p lerow tm ALN0815 internally matched lna module t he plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satell ite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its uncondition ally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board i n mass production level. parameter unit specifications min typ max frequency range mhz 806 824 gain db 29.0 30.0 gain flatness db 0.1 0.2 noise figure db 0.75 0.8 output ip3 dbm 38.5 39.5 s11/s22 db - 18/ - 12 output p1db dbm 19 20 swi tching time (3) m sec - supply current ma 170 200 supply voltage v 5 impedance w 50 max. rf input power dbm c.w 29~31 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 c to +85 c. 1) oip3 is measured with two tones at an output power of 4 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fro m 0 v to v s . pin number function 3 rf in 8 rf out 10 v s other s ground ou t line drawing (unit: mm) feature s s 21 = 30.1 db@806 mhz = 29.9 db@824 mhz nf of 0.75 db over fr e quency unconditionally stable single 5 v supply high oip3@low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding co nsider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description ALN0815 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o du ction) typ.@t = 25 c, v s = 5 v, freq. = 815 mhz, z o.sys = 50 ohms
2 / 4 www.asb.co.kr january 2011 p lerow tm ALN0815 internally matched lna module s - param e ters noise figure oip3 p1db 806~824 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr january 2011 p lerow tm ALN0815 internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 806 mhz 815 mhz 824 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s2 1 (db) s11 (db) s22 (db) 4.50 v 30.08 - 23.62 - 16.44 30.02 0.14 - 24.62 - 16.41 29.94 - 25.52 - 16.29 4.75 v 30.21 - 23.70 - 16.50 30.14 0.15 - 24.70 - 16.49 30.06 - 25.68 - 16.37 5.00 v 30.32 - 23.61 - 16.57 30.25 0.15 - 24.64 - 16.56 30.17 - 25.57 - 16.47 5.25 v 30.4 0 - 23.70 - 16.62 30.33 0.15 - 24.68 - 16.62 30.25 - 25.73 - 16.48 5.50 v 30.48 - 23.65 - 16.66 30.41 0.15 - 24.71 - 16.62 30.33 - 25.66 - 16.47 806 mhz 815 mhz 824 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 41.32 19.48 0.713 41.02 19.37 0.702 40.79 19.21 0.717 4.75 v 41.78 20.00 0.730 41.44 19.93 0.713 41.46 19.84 0.730 5.00 v 40.75 20.47 0.747 40.90 20.48 0.751 41.00 20.26 0.743 5.25 v 39.20 20.92 0.767 39.41 20.89 0 .780 39.47 20.70 0.766 5.50 v 37.95 21.34 0.789 38.20 21.27 0.798 38.45 21.15 0.796 806 mhz 815 mhz 824 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 c 30.65 - 18.83 - 16.43 30.58 0.15 - 19.40 - 16.95 30.50 - 19.99 - 17.29 - 10 c 30.55 - 21.14 - 16.65 30.47 0.16 - 21.88 - 16.90 30.39 - 22.82 - 17.00 25 c 30.46 - 23.33 - 16.54 30.39 0.17 - 24.20 - 16.90 30.29 - 25.02 - 16.69 60 c 30.31 - 25.00 - 16.48 30.23 0.16 - 26.03 - 16.27 30.15 - 27.17 - 15.84 85 c 30.20 - 25.04 - 16.20 30.12 0.18 - 26.09 - 15.93 30.02 - 27.25 - 15.41 806 mhz 815 mhz 824 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 c 39.25 20.14 0.504 39. 42 20.28 0.511 39.50 20.39 0.501 - 10 c 40.02 20.20 0.623 40.23 20.32 0.625 40.40 20.46 0.620 25 c 40.74 20.35 0.751 40.81 20.50 0.747 40.99 20.65 0.750 60 c 40.30 20.38 0.889 40.12 20.51 0891 40.05 20.68 0.874 85 c 39.95 20.24 0.977 39.60 20.40 0.9 83 39.58 20.50 0.980 rf performance with operating temperature rf perform ance with voltage change
4 / 4 www.asb.co.kr january 2011 p lerow tm ALN0815 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by custom er s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for al lowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n clu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the val ue of c1 & c2 is determined by considering the application fr e- quency. application circuit recom mended soldering reflow process + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 c/sec) ramp - down (6 c/sec) in out vs size 25x25mm (for aln series C 13x13mm) evaluation board layout
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